ГОСТ Р МЭК 61191-3-2019. Национальный стандарт Российской Федерации. Печатные узлы. Часть 3. Монтаж в сквозные отверстия. Технические требования

Библиография

 

Ссылки на IEC и ISO

IEC 60068-2-20, Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-58, Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

IEC 61188-5-1, Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

IEC 61188-5-2, Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

IEC 61188-5-3, Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

IEC 61188-5-4, Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

IEC 61188-5-5, Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

IEC 61188-5-6, Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

IEC 61188-7, Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

IEC 61189-2, Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

IEC 61190-1-2, Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for highquality interconnects in electronics assembly

IEC 61193-1, Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

IEC 61193-3, Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

IEC 62326-1, Printed boards - Part 1: Generic specification

IEC 62326-4, Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

IEC 62326-4-1, Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

IEC PAS 62326-7-1, Performance guide for single- and double-sided flexible printed wiring boards

ISO 9001, Quality management systems - Requirements

Другие ссылки

IPC-TM-650, Test Methods Manual

2.3.25 Detection and measurement of ionizable surface contaminants by resistivity of solvent extract

2.3.25.1 Ionic Cleanliness Testing of Bare PWBs

2.3.27 Cleanliness test - residual rosin

2.3.38 Surface organic contamination detection test

2.4.22 Bow and twist (percentage)

2.6.3.3 Surface insulation resistance, fluxes

IPC-9191, General Requirements for Implementation of Statistical Process Control

IPC-OI-645, Standard for Visual Optical Inspection Aids

IPC-SM-817, General Requirements for Dielectric Surface Mounting Adhesives

J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies

J-STD-002, Solderability Tests for Component Leads, Terminals, Lugs Terminals and Wires

J-STD-003, Solderability Tests for Printed Boards

J-STD-004, Requirements for Soldering Fluxes

J-STD-005, General Requirements and Test Methods for Electronic Grade Solder Paste

J-STD-006, General Requirements and Test Methods for Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Solder Applications

J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

 

 

 

 

 

УДК 621.3.049.75:006.354	ОКС 31.240
Ключевые слова: печатный узел, поверхностный монтаж, классификация электронных и электрических сборок, припой, флюс, пайка печатного узла, технические требования